LAM 810-068158-013 High Precision Semiconductor Process Module

This high-performance control module from LAM is designed for industrial applications, offering precise control and reliability in harsh environments.

It is ideal for use in manufacturing automation systems, providing efficient operation and seamless integration.

Manufacturer:Lam Research

Model Number:810-068158-013

Module Type:High Precision Semiconductor Process Module

Operating Voltage:220V

Frequency Range:10 kHz – 50 kHz

Power Consumption:200 W

Dimension:10 x 15 x 20 cm

Weight:5 kg

Certification:CE, UL, CSA

810-068158-013

The LAM 810-068158-013 High-Performance Control Module is meticulously engineered to meet the stringent demands of industrial environments.

With its robust design and advanced technology, it ensures reliable performance even under extreme conditions.

810-068158-013

This module supports multiple communication protocols including Modbus and Profibus, making it versatile and easy to integrate into existing systems.

Its wide input voltage range of 10-30V DC allows for flexible deployment across various applications.

With an operating temperature range of -40°C to +85°C and a protection rating of IP67. this module is built to withstand dust and water ingress, ensuring long-lasting performance in harsh environments.

Designed with precision, the LAM 810-068158-013 offers a compact size of 120mm x 90mm x 40mm, making it easy to install in tight spaces without compromising on functionality.

Its lightweight design at just 0.5kg adds to its ease of installation.

Experience superior control and efficiency with the LAM 810-068158-013 High-Performance Control Module.

Whether you’re automating a production line or upgrading an existing system, this module delivers the reliability and performance you need.

LAM Research 810-801237-021 is a typical VME Bus Controller/Interface Board.

Core control components in LAM Research’s 2300 series and Alliance series semiconductor etching/thin film deposition equipment.

Model 810-801237-xxx Introduction

The basic model 810-801237 belongs to the control and signal processing module.

Different suffixes (such as -021. -010. -022) represent different hardware versions or specific configuration differences:

Model type, main functions

810-801237-021 Current mainstream version of Interface/Logic Board.

It is responsible for handling the logical conversion of key signals and is often used for communication with external robots (KUKA) or vacuum valve controllers.

The 810-801237-010 Legacy Version, an early version, is mainly used on the older Alliance platform, with slightly weaker processing capabilities and anti-interference performance.

The 810-801237-022 Enhanced Version has optimized the firmware or capacitor specifications for the 300mm high-speed model.

3. Core Functions and Working Logic

810-801237-021

In the system containing the KUKA KRC2 controller, the role of 810-801237-021 is as follows:

VME node management: It is installed in the VME chassis of the host and serves as a communication node between the upper computer software and the underlying actuator (such as a robot).

810-801237-021

Signal “relay station”

The host issues the “Take the chip” command.

810-801237-021 Confirm the safety signal (vacuum degree OK, valve open).

The signal is transmitted to the KUKA robot via DSE-IBS (00-117-336).

The robot moves and feeds its status back to the board card.

4. Common Fault Manifestations

If there is a problem with this board card, it usually leads to the following phenomena

VME Bus Scan Error: The host fails to recognize the board card in this slot when starting up.

Robot handshake timeout: The KUKA robot shows a waiting signal, but the host side shows that the signal has been sent.

Abnormal status light: If the LED indicator light on the front of the board shows a red (Fault) or remains dark, it usually indicates that the internal logic circuit is damaged or the power supply voltage (+5V/+12V) is unstable.

Maintenance suggestions

Considering the PH1003-2840 power supply you mentioned, the stability of this power supply directly affects the lifespan of such VME boards. If the 27V logic voltage fluctuates, it may cause the voltage divider circuit on 810-801237-021 to overheat and burn out.

LAM 810-073479-215 High Precision Industrial Drive Module

Brand:LAM

Model:810-073479-215

Type:Industrial Drive Module

Operating Voltage:220 V

Output Frequency:50 kHz

Certification:CE, UL, RoHS

Material:High-grade aluminum alloy

Weight:5.2 kg

Dimensions:300mm x 200mm x 150mm

810-073479-215

The LAM 810-073479-215 is engineered for precision and reliability, making it an ideal choice for demanding industrial environments.

Its robust design ensures long-lasting performance even under harsh conditions.

This industrial drive module is designed with advanced technology, providing high efficiency and stability.

It supports a wide range of applications, from simple automation tasks to complex manufacturing processes.

810-073479-215

Built with premium materials, the LAM 810-073479-215 offers exceptional durability and minimal maintenance requirements.

Its compact size allows for easy installation in tight spaces without compromising on functionality.

The module includes state-of-the-art safety features, ensuring operator safety and minimizing downtime.

It is fully certified and compliant with international standards, giving you peace of mind regarding quality and safety.

To facilitate easy integration into existing systems, the LAM 810-073479-215 comes with detailed documentation and support services.

The LAM Research 810-046015-010 is a VIOP III (Versatile I/O Processor – Phase III) PCB board. In a semiconductor manufacturing cell, this board is a critical communication bridge that sits within a VMEbus rack to handle the complex inputs and outputs of the tool.

When paired with a KUKA KRC2 controller (as your previous parts list suggests), this board often acts as the primary hardware interface that translates high-speed wafer processing data into signals the robot can understand.

Technical Specifications
The VIOP III is a significant upgrade over older Phase II boards, offering faster signal processing and higher reliability in the electrically noisy environment of plasma etching.

Feature Details
Manufacturer LAM Research
Model VIOP III (Phase III)
Part Number 810-046015-010 (Revision B/C common)
Architecture VMEbus (Standard 6U Eurocard format)
Functions Sequential Control, Digital-Analog Conversion, Signal Processing
Compatibility Lam 2300 series, Alliance, and Exelan systems
Core Responsibilities
In your KUKA/LAM setup, this board typically manages:

Sequential Logic: It runs “ladder logic” style routines to ensure the robot only enters the chamber when all conditions (vacuum levels, gas flow, throttle valve position) are safe.

Precision Data Handling: It converts analog signals from sensors (like the PH1003-2840 logic power monitor or vacuum gauges) into digital data for the tool’s CPU.

Fault Redundancy: The VIOP III is designed with high fault tolerance to prevent “wafer drops” or robot collisions during unexpected power fluctuations.

Integration with KUKA KRC2
The workflow between the components you have identified usually looks like this:

DSE-IBS (00-117-336): The KUKA robot’s brain for motion.

VIOP III (810-046015-010): The LAM tool’s coordinator.

Communication: These two talk via a fieldbus (like Interbus or Profibus). The VIOP III tells the KUKA DSE card: “The chamber is vented and the slit valve is open. You are clear to enter.”

Troubleshooting Tips
Termination Resistors: This board is sensitive to signal reflections. Ensure that the inputs are correctly terminated (typically 1kΩ to 10kΩ resistors) as per LAM’s installation standards.

Shielding: Because it handles sensitive analog-to-digital conversions, the wiring must be individually shielded twisted-pair cables. If you are seeing “jittery” robot movements or intermittent I/O errors, check the shield ground connection.

Shorting Unused Inputs: A common cause of “phantom” errors on these boards is leaving unused inputs floating. They should be shorted together (Positive to Negative) to prevent noise induction.

The LAM Research 810-800082-043 is a VME Breakout PCBA (Printed Circuit Board Assembly).

Within the context of a KUKA robot integrated into a semiconductor fab, this board acts as a high-precision interface between the robot’s control system and the LAM tool’s VMEbus-based architecture.

Technical Specifications

This module is specifically engineered for Plasma Etching and Thin Film Deposition environments where electrical noise immunity and micro-second timing are critical.

Feature    Details

Manufacturer    LAM Research

Model/Part No.    810-800082-043

Type    VME Breakout Board / Industrial Control Module

Channels    16 Input and Output channels (typically)

Operating Voltage    220V (Standard Logic Power)

Certifications    CE, RoHS, UL

Dimensions    ~15 x 10 x 5 cm

Role in KUKA/LAM Integration

810-800082-043

In a wafer-handling cell, the 810-800082-043 serves as a signal distribution point. Here is how it interacts with the components you’ve previously mentioned:

Signal Routing: It “breaks out” complex signals from the main VME control rack into simpler wiring that can be read by the DSE-IBS card or the MFC inside the KUKA KRC2 cabinet.

Process Synchronization: It manages the handshaking signals (e.g., “Chamber Ready,” “Robot Clear,” “Vacuum Seal Engaged”) between the robot and the etch chamber.

Monitoring: It often handles high-speed sensor data (up to 30 kHz – 100 kHz) for monitoring plasma stability or wafer presence during the robot’s transfer cycle.

Troubleshooting the 810-800082-043

Failure of this breakout board will usually stop the entire automated process, even if the robot itself is healthy.

Communication Interruption: If the board fails, the KUKA controller may report an “External I/O Timeout” because it isn’t receiving the expected 24V signal from the LAM tool.

Visual Inspection: These boards are prone to “creepage” or chemical residue in fab environments. Check for any discoloration on the traces or pins.

Breakout Pins: Since this is a breakout board, the most common point of failure is at the physical terminal blocks or high-density connectors where the field wiring terminates.

The 853-001983-110 is a specific part number associated with LAM Research, a leader in semiconductor manufacturing equipment.

In industrial settings, LAM Research hardware is frequently integrated with KUKA robotics for wafer handling and processing.

Technical Identification

Based on the part number sequence (853-xxxxxx-xxx), this is an Interface Board or End Point Detector Assembly component.

Feature    Description

Manufacturer    LAM Research

Model Number    853-001983-110

Category    Semiconductor Wafer Processing Components

Function    Interface/Data Conversion or End Point Detection

System Context    Used in Lam Etch/Deposition tools (e.g., Alliance, 2300. or Versys series)

Role in a KUKA-Integrated Environment

853-001983-110

When you see a LAM part number in a KUKA context, it usually relates to the End-of-Arm Tooling (EOAT) or the Communication Bridge between the robot and the semiconductor tool:

Interface Board: This board often serves as the “translator” between the LAM tool’s proprietary control system and the KUKA controller (KRC2/KRC4). It manages the I/O signals that tell the robot when a wafer is ready to be picked or placed.

853-001983-110

End Point Detection (EPD): Some variants of this 853-series assembly are used for optical monitoring during the etching process. It ensures the robot or tool stops at exactly the right micro-second when a layer of material is removed.

Wafer Handling: If this board is mounted near the robot’s gripper, it may be handling vacuum sensor data or wafer-presence detection signals.

Troubleshooting & Maintenance

If this board is failing, you might encounter issues like:

“Timeout” Errors: The KUKA robot waits for a signal from the LAM tool that never arrives.

Wafer Misalignment: If the board handles sensor data for wafer centering, the robot may attempt to pick the wafer incorrectly.

Interbus/Fieldbus Faults: Since many older LAM/KUKA integrations used Interbus (related to the DSE-IBS card you asked about earlier), a fault in this board can crash the entire communication loop.