Tag: AMAT

Product overview
AMAT 0040-54755 and 0041-75950 are ASP (Advanced Semiconductor Processing) Applicator components specially designed by Applied Materials(AMAT) for semiconductor manufacturing process, which adopt Low Heat Exchange technology and are suitable for precision thin film deposition and etching equipment. This series of products optimizes the thermal management performance of the process chamber and ensures a high uniformity and low heat load process environment.

Core characteristics
Low temperature exchange design
The adoption of special materials and structural design can significantly reduce the heat transfer in the process, reduce the temperature fluctuation of the substrate and improve the uniformity of film deposition (uniformity < 2%).
Suitable for temperature-sensitive high-precision processes (such as ALD and low-k dielectric layer deposition).
Materials and durability
High-purity ceramics or special alloys are used, which are resistant to plasma corrosion and high-temperature oxidation (up to 400°C).
Modular design facilitates quick replacement and reduces equipment maintenance downtime (MTTR < 30 minutes).
Compatibility and application
Adapt to many mainstream devices of AMAT (such as Endura® and Centura® series), and support logic chips, memories and advanced packaging processes.
Especially suitable for nodes that need to strictly control the Thermal Budget (such as FinFET and GAA transistor below 3nm).

Product overview
AMAT 0021-26609 SHUTTER DISK is a key component of the ENDURA PVD system of Applied Materials (Amat), which is specially designed for high-precision semiconductor thin film deposition process. This part works with A101 cavity and TTN(Turbo-Thermal Needle) center needle to ensure process stability and deposition uniformity.

Core characteristics

Precision control: optimize the material flow direction and improve the uniformity and consistency of PVD (physical vapor deposition) process.
High temperature resistant design: special alloy is adopted to adapt to the harsh semiconductor manufacturing environment with high vacuum and high temperature.
Key applications: used in advanced logic and memory chip manufacturing, supporting the deposition of high yield copper interconnection structure.
Typical use

Deposition of metal films such as copper and aluminum in semiconductor manufacturing
Core components of high-precision PVD process cavity