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AMAT 0010-78680 Pneumatic control module

The part number 0010-78680 refers to a specialized component from Applied Materials (AMAT), the global leader in semiconductor, display, and solar manufacturing equipment.

Based on AMAT’s technical nomenclature, this part is typically identified as a Pneumatic Solenoid Valve Manifold or a Gas/Pneumatic Control Assembly used within the Endura, Centura, or Producer platforms (which are the industry standards for PVD, CVD, and Etch processes).

1.Introduction

The AMAT 0010-78680 is a precision-engineered pneumatic control module designed for semiconductor fabrication tools. It acts as the “nervous system” for the vacuum chamber’s mechanical movements, controlling the actuation of slit valves, lift pins, and gas flow shutters. Because semiconductor manufacturing requires ultra-high vacuum (UHV) environments and zero contamination, this component is built to withstand millions of cycles with extreme repeatability and minimal particle generation.

2. Technical Parameter Table

ParameterSpecification (Typical)
ManufacturerApplied Materials (AMAT)
Part Number0010-78680
Device TypePneumatic Solenoid Manifold / Valve Assembly
Operating Voltage24V DC (Standard for AMAT tool logic)
Pressure Range60 – 90 PSI (Compressed Dry Air / CDA)
Connector TypeMulti-pin D-Sub or Circular Military-style connector
Gas CompatibilityCDA (Compressed Dry Air), N2 (Nitrogen)
Response Time< 20 ms
MaterialsAnodized Aluminum / Stainless Steel / High-grade Fluoroelastomers

3. Related Models

This part belongs to a family of pneumatic assemblies often used in specific AMAT tool configurations:

0010-76001: Similar pneumatic manifold used in earlier Centura models.

0010-20123: Solenoid valve used for chamber venting.

0010-35000 Series: Various pneumatic controllers for the Endura platform.

0190-XXXXX Series: Often represents the individual valves mounted onto the 0010-78680 manifold.

4. Application Cases

Wafer Handling: Controlling the pneumatic cylinders that move the “Robot Arm” or “Slit Valve” which allows wafers to pass between the Load Lock and the Process Chamber.

Chamber Sequencing: Managing the lift pin assembly that raises and lowers the wafer onto the electrostatic chuck (ESC).

Process Gas Control: Operating the pneumatic actuators for gas box valves to ensure precise timing of precursor gas delivery during CVD (Chemical Vapor Deposition).

5. Product Advantages and Features

High Reliability: Engineered for high-volume manufacturing (HVM) where tool downtime costs thousands of dollars per minute.

Plug-and-Play Integration: Specifically keyed for AMAT’s proprietary wiring harnesses and software interfaces.

Cleanroom Compatible: Materials are selected to ensure they do not outgas or shed particles that could ruin a silicon wafer.

Integrated Diagnostics: Often includes LED status indicators for each solenoid to allow for rapid troubleshooting by field service engineers.

6. Other Models in the Same Series (AMAT Control Modules)

AMAT 0010-XXXXX: Mechanical/Pneumatic Assemblies.

AMAT 0020-XXXXX: Quartz and Ceramic Consumables.

AMAT 0040-XXXXX: Power Distribution and Cables.

AMAT 0190-XXXXX: Individual Gas/Pneumatic Valves (often sourced from SMC or Nor-Cal to AMAT specs).

AMAT 0040-54755, 0041-75950 applicator, ASP, low heat exchange

Product overview
AMAT 0040-54755 and 0041-75950 are ASP (Advanced Semiconductor Processing) Applicator components specially designed by Applied Materials(AMAT) for semiconductor manufacturing process, which adopt Low Heat Exchange technology and are suitable for precision thin film deposition and etching equipment. This series of products optimizes the thermal management performance of the process chamber and ensures a high uniformity and low heat load process environment.

Core characteristics
Low temperature exchange design
The adoption of special materials and structural design can significantly reduce the heat transfer in the process, reduce the temperature fluctuation of the substrate and improve the uniformity of film deposition (uniformity < 2%).
Suitable for temperature-sensitive high-precision processes (such as ALD and low-k dielectric layer deposition).
Materials and durability
High-purity ceramics or special alloys are used, which are resistant to plasma corrosion and high-temperature oxidation (up to 400°C).
Modular design facilitates quick replacement and reduces equipment maintenance downtime (MTTR < 30 minutes).
Compatibility and application
Adapt to many mainstream devices of AMAT (such as Endura® and Centura® series), and support logic chips, memories and advanced packaging processes.
Especially suitable for nodes that need to strictly control the Thermal Budget (such as FinFET and GAA transistor below 3nm).

AMAT 0021-26609 SHUTTER DISK,A101,TTN, center needle

Product overview
AMAT 0021-26609 SHUTTER DISK is a key component of the ENDURA PVD system of Applied Materials (Amat), which is specially designed for high-precision semiconductor thin film deposition process. This part works with A101 cavity and TTN(Turbo-Thermal Needle) center needle to ensure process stability and deposition uniformity.

Core characteristics

Precision control: optimize the material flow direction and improve the uniformity and consistency of PVD (physical vapor deposition) process.
High temperature resistant design: special alloy is adopted to adapt to the harsh semiconductor manufacturing environment with high vacuum and high temperature.
Key applications: used in advanced logic and memory chip manufacturing, supporting the deposition of high yield copper interconnection structure.
Typical use

Deposition of metal films such as copper and aluminum in semiconductor manufacturing
Core components of high-precision PVD process cavity

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